911chaxun查询科学技术名词电子元器件工艺与分析技术
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成核 相关科技名词
- 磨球面contouring
- 磨圆rounding
- 磨边edging
- 捏练pugging
- 喷雾干燥spray drying
- 去蜡dewaxing
- 排气evacuating
- 热压铸injection moulding
- 热压hot pressing
- 热挤压hot extrusion
- 筛分析法sieve analysis
- 上釉glazing
- 匣钵sagger
- 修整trimming
- 预烧calcination
- 压滤filter-press
- 预压prepressing
- 振动磨vibration milling
- 选粒granulation
- 注浆slip-casting
- 轧膜roll forming
- 差热分析differential thermal analysis;DTA
- 中子活化分析neutron activation analysis;NAA
- 离子探针谱[学]ion microprobe
- 离子微分析ion microanalysis
- 俄歇电子能谱[学]Auger electron spectroscopy;AES
- 内反射谱[学]internal reflection spectroscopy;IRS
- 外反射谱[学]external reflection spectroscopy;ERS
- 光声拉曼谱[学]photoacoustic Raman spectros-copy;PARS
- 低能电子衍射low energy electron diffraction;LEED
- 反射高能电子衍射reflection high energy electron diffraction;RHEED
- 透射高能电子衍射transmission high energy electron diffraction;THEED
- 紫外光电子能谱[学]UV photoelectron spectroscopy;UPS
- X射线光电子能谱[学]X-ray photoelectron spectroscopy;XPS
- 离子散射谱[学]ion scattering spectroscopy;ISS
- 二次离子质谱[学]secondary ion mass spectroscopy;SIMS
- 中能电子衍射medium energy electron diffraction;MEED
- 出现电势谱[学]appearance potential spectroscopy;APS
- 电子探针electron microprobe
- 化学分析电子能电子能谱谱[学]electron spectroscopy for chemical analysis
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