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信号传输 相关科技名词
- 扁平封装flat pack;flat package
- 组装密度packaging density
- 高密度组装high-density packaging
- 高密度装配high-density assembly
- 微组装micropackage
- 微结构microstructure
- 微模块micromodule
- 机箱chassis
- 格式结构trellis
- 插件导轨card guide
- 插座socket
- 装配件subassembly
- 插入plug-in
- 插件架card rack
- 插孔jack
- 插孔板jack panel
- 操作开关joyswitch
- 原型结构prototype construction
- 实验电路板breadboard
- 多层印制板multilayer printed circuit board
- 双面印制板two-sided printed circuit board
- 玻璃环氧板glass epoxy board
- 层压板laminate
- 表面surface
- 表面安装焊接surface mount solder
- 焊盘bonding pad
- 倒焊face-down bonding
- 压焊bonding
- 热压焊thermocompression bonding
- 浸焊dip-soldering
- 波峰焊wave-soldering
- 可焊性solderability
- 去焊枪desoldering gun
- 吸锡器solder sucker
- 配线架distribution frame
- 接线wiring
- 绕接wire wrap
- 双列直插封装dual-in-line package;DIP
- 单列直插封装single in-line package;SIP
- 无引线芯片载体leadless chip carrier;LLCC
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