911chaxun查询科学技术名词电子元器件工艺与分析技术
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曝光 相关科技名词
- 等离子[体]去胶removing of photoresist by plasma
- 边缘效应side effect
- 刻蚀etching
- 干法刻蚀dry etching
- 反应离子刻蚀reactive ion etching;RIE
- 各向同性刻蚀isotropic etching
- 各向异性刻蚀anisotropic etching
- 反应溅射刻蚀reactive sputter etching
- 离子铣ion beam milling
- 等离子[体]刻蚀plasma etching
- 钻蚀undercutting
- 剥离技术lift-off technology
- 终点监测endpoint monitoring
- 金属化metallization
- 互连interconnection
- 多层金属化multilevel metallization
- 电迁徙electromigration
- 回流reflow
- 磷硅玻璃phosphorosilicate glass
- 硼磷硅玻璃boron-phosphorosilicate glass
- 钝化工艺passivation technology
- 多层介质钝化multilayer dielectric passivation
- 划片scribing
- 电子束切片electron beam slicing
- 烧结sintering
- 印压indentation
- 热压焊thermocompression bonding
- 热超声焊thermosonic bonding
- 冷焊cold welding
- 点焊spot welding
- 球焊ball bonding
- 楔焊wedge bonding
- 内引线焊接inner lead bonding
- 外引线焊接outer lead bonding
- 梁式引线beam lead
- 装架工艺mounting technology
- 附着adhesion
- 封装packaging
- 金属封装metallic packaging
- 陶瓷封装ceramic packaging
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