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阶跃函数 相关科技名词
- 小引出线封装small outline package;SOP
- 四面扁平封装quad flat package;QFP
- 引脚阵列封装pin grid array;PGA
- 球阵列封装ball grid array;BGA
- 封装可靠性package reliability
- 早期失效early failure
- 磨损失效wear-out failure
- 非特fit;failure in term
- 厚膜thick film
- 厚膜电路thick film circuit
- 厚层压板thick laminated plate
- 薄膜thin film
- 薄膜电路thin film circuit
- 介质隔离dielectric isolation
- 衬底substrate
- 刻蚀etch
- 腐蚀切割etch cutting
- 老化burn-in
- 老化试验degradation testing
- 印制板测试PCB testing
- 电路内测试in-circuit test
- 可检测性detectability
- 拉偏测试high low bias test
- 诊断软盘diagnostic diskette
- 示波器oscilloscope
- 时域反射仪time domain reflectometer;TDR
- 闭环电波探测器closed-loop radar
- 采样器sampler
- 采样速率sampling rate
- 采样插件sampling plug-in
- 采样系统sampling system
- 探头probe
- 夹具fixture
- 电流源current source
- [信号]源阻抗source impedance
- 晶体振荡器crystal oscillator
- 隧道二极管tunnel diode
- 电源power supply
- 稳压电源constant voltage power supply
- 参考电源reference power supply